Biography

Ephraim Suhir is on the faculty of the Portland State University, Portland, OR, USA, and Technical University, Vienna, Austria. He is also CEO of the Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA. Ephraim is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); IEEE Life Fellow; Fellow of the American Physical Society (APS), the American Society of Mechanical Engineers (ASME), the Institute of Physics (IoP), UK, the Society of Optical Engineers (SPIE), the International Microelectronics and Packaging Society (IMAPS), the Society of Plastics Engineers (SPE), and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA) . Dr. Suhir has authored about 400 publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering (he is the third Russian American, after S. Timoshenko and I. Sikorsky, who received this prestigious award); and 1996 Bell Laboratories Distinguished Member of Technical Staff (DMTS) Award for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products.

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Research Interest

Applied Mathematics, Applied and Mathematical Physics, Materials Science and Engineering, Applied Mechanics; Applied Probability, Probabilistic Analyses and Probability-Based Physical Designs of Electron Devices; Probabilistic Methods in Reliability Engineering, Probabilistic Risk Assessment and Management; Analytical (Mathematical) Modeling in Applied Science and Engineering; Photonics, Fiber Optics, Mechanics of Optical Fibers and Systems; Design for Reliability (DfR) of Electronic, Opto-Electronic and Photonic Systems; Composite and “Smart” Materials and Systems; Thin Film Mechanics and Physics; Shock and Vibration Analyses and Testing; Dynamic Response of Materials and Structures to Shocks and Vibrations; Thermal Stress Analysis, Prediction and Prevention of Thermal Stress Failures; Solder Materials and Solder Joint Interconnections in Electronic and Optical Engineering;Embedded Systems; Polymeric Materials in Electronics and Photonics; Photovoltaic and Thermo-Electric Modules: Physical Design for Reliability; Nanotechnologies and Nanomaterials; Stretchable (Large Area) Electronics and Photonics: Physical Design for Reliability; Lattice-Misfit Systems: Stress Analysis and Reliability Evaluations; Technical Diagnostics, Prognostics and Health Monitoring (PHM); Vehicular (Automotive, Aerospace, Maritime) Electronics and Photonics: Design for Reliability; “Human-in-the-Loop”: Human-Equipment-Environment Performance and Interaction; Quantification of the Role of the Human Factor in Various Tasks, Missions and Situations;Avionics and Outer Space Psychology