Date

June 22-23, 2021

Location

Osaka, Japan

About Laser Materials Processing

The Laser Materials Processing Conference welcomes the global audience to participate in the conference which is to be held on June 22-23, 2021 at Osaka, Japan. The main theme of the conference is “Estimating the future laser marketing”. This conference brings together the innovations in materials processing and brings the key opinion leaders and thought leaders in the field from around the world for two intensive days of scientific presentations, networking as well as engagement with companies developing innovations in tools and technologies in this space. The purpose of Materials Processing 2021 is to provide an international technical forum to showcase recent advances in Laser and Materials Processing Materials Processing 2021 brings together top researchers and emerging research leaders to spark scientific exchange and create community.


Vladimir Rumyantsev

Vladimir Rumyantsev

Head Of Physics Department, Galkin Institute for Physics & Engineering, Ukraine

R Glen Calderhead

R Glen Calderhead

Executive Managing Director, Lutronic Corporation, Korea

Bekir Sami Yilbas

Bekir Sami Yilbas

Distinguished Professor, King Fahd University of Petroleum and Minerals, Saudi Arabia

Vladimir Chigrinov

Vladimir Chigrinov

Professor Emeritus, Hong Kong University of Science and Technology, Hong kong

Nathaniel Quick

Nathaniel Quick

Executive Director, Laser Institute of America, USA

Shuhei Kodama

Tokyo University of Agriculture and Technology, Japan

Guan Yingchun

Beihang University, China

Hemashilpa Kalagara

Lumentum Operations LLC, USA

What We Offer?

Meet Experts

Global Networking

Learning In a New Space

New Tips & Tactics

Certification

Venue Information

Beautiful location in the heart of the city

Location

We will update soon...

Transport

To get to the venue place, you can take one of the city bus lines, tube or railway service. All the services are comfortable to reach into the place.

Attractions