About materialsengineering-2021

Meetings International presents the 20^th International Conference on Materials Engineering and Nanotechnology, scheduled during October 26-27, 2021 at Osaka, Japan, which will allow the professional to characteristic their exploration of work through introductions and have a probability to select up mastering about the present circumstance of Materials Engineering. Major attractions of this event would revolve around keynote presentations, oral presentations and poster presentations. This year we are focusing on the theme “Advancing the research & innovation on Materials Engineering ".

Materials engineering to be the constantly trending subject matter with modern day research technologies. Everyone who explores to strengthen their knowledge and gain extended about advanced technical cleverness is welcome to present/get new ideas. Materials Engineering Conference captivates individuals both from commercial and academic worlds yet establishes a firm link and binds us together with the recent updated accomplishments. We provide a good opportunity by admiring your updated research and also by publishing it in our respective journals. We assure our attendees return to their place with the self-belief to improve their abilities and outfitted with certified approaches to work with us. This meeting will allow the attendees to acquire these new updates and share their experiences with well-recognized speakers globally.

Who Should Attend?

A great opportunity to network with your peers from academia and industry:

All the Stake Holders (both Academia & Industry) of the Sector
Researchers & Innovators
Experts Looking for Collaborative Work
Product Developers
Solution Providers
Sales & Marketing Professionals
Associations, Societies, & Professional Bodies
Funding Agencies & Fund Raisers
Management Bodies
Decision Makers

Why to Attend?

Be the first to showcase your research, innovation and brand to gain competitive advantages. Meet your target audience and explore your product and services.